Vertiv Launches CoolLoop Trim Cooler: High-Density, Hybrid Cooling for AI Applications

TL;DR:

• Vertiv introduces the CoolLoop Trim Cooler, a new heat rejection system for AI and HPC environments.
• The system supports hybrid liquid and air cooling, offering significant energy and space savings.
• It handles fluctuating water temperatures, crucial for AI and high-density computing.
• The solution is designed for easy integration with liquid cooling systems, including direct-to-chip and immersion.

Vertiv, a global leader in critical digital infrastructure and continuity solutions, has expanded its thermal management portfolio with the launch of the Vertiv™ CoolLoop Trim Cooler. This innovative system is designed to support both air and liquid cooling applications, specifically tailored for the demanding environments of artificial intelligence (AI) and high-performance computing (HPC). This global solution addresses the diverse climate conditions required for hybrid-cooled or liquid-cooled data centers and AI factories.

Energy Efficiency and Space Savings

The Vertiv CoolLoop Trim Cooler integrates seamlessly with high-density, liquid-cooled environments, delivering substantial operational efficiency and aligning with the industry’s need for energy-efficient and compact cooling solutions. Compared to traditional systems, it offers up to a 70% reduction in annual cooling energy consumption through the utilization of free-cooling and mechanical operation. Furthermore, it achieves a 40% reduction in space requirements, making it an ideal solution for space-constrained environments.

Addressing the Demands of AI Factories

The system is engineered to tackle the unique challenges posed by modern AI factories, supporting fluctuating supply water temperatures up to 40°C and cold plate functionality at 45°C. This adaptability is crucial for the dynamic cooling needs of AI and HPC applications.

Simplified Integration and Compatibility

The Vertiv CoolLoop Trim Cooler features straightforward water connections, facilitating smooth and direct system integration with Vertiv™ CoolChip CDU coolant distribution units for direct-to-chip cooling. Additionally, it can connect directly to immersion cooling systems. This simplifies installation and reduces operational complexity, ensuring compatibility across various high-density cooling environments, and ultimately saving customers time and costs.

Cheehoe Ling, vice president, product management Asia at Vertiv, emphasized the importance of this solution for the Asian market, stating, “Asia’s rapid digital transformation and AI-driven growth demand innovative cooling solutions that can handle high heat densities while improving energy efficiency. The Vertiv™ CoolLoop Trim Cooler is ideal for the region’s diverse climate conditions, providing scalable, high density cooling that reduces energy use and operational complexity.”

Environmentally Conscious Design

The Vertiv™ CoolLoop Trim Cooler utilizes low-GWP refrigerant and offers a scalable cooling capacity of up to almost 3 MW in the air-cooled configuration. Its free cooling coils are optimized for high ambient temperatures, enabling operation in free cooling mode across more seasons and conditions, thereby reducing electrical consumption and CO2e emissions. Importantly, the system is compliant with the 2027 EU F-GAS regulations ban, eliminating the need for costly redesigns or infrastructure upgrades.

For more information on the Vertiv CoolLoop Trim Cooler, Vertiv CoolChip CDU family, and other Vertiv solutions for AI acceleration, visit Vertiv.com.